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Patent Searching and Data


Title:
WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2011/096019
Kind Code:
A1
Abstract:
Provided is a wire saw which uses a cutting wire to cut a workpiece, this wire saw being such that wire tension can be adjusted with high responsiveness. The wire saw has first and second workpiece cutting sections (1A, 1B). The workpiece cutting sections (1A, 1B) each comprise a pair of guide rollers (10a, 10b). A wire (W) is passed over these guide rollers, resulting in workpiece cutting wire groups being formed. This wire saw is further provided with a control device (50) and a tension detection device (18) which detects the tension of the wire (W) between the workpiece cutting sections (1A, 1B). On the basis of the tension detected by the tension detection device (18), the control device (50) changes the rotational speed of the guide rollers (10a, 10b) of at least one of the workpiece cutting sections so that tension will be brought within an acceptable range.

Inventors:
HOSHIYAMA, Toyohiro (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
星山豊宏 (〒01 広島県広島市南区宇品東5丁目3番38号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
IMAKURUSU, Shoji (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
今久留主昌治 (〒01 広島県広島市南区宇品東5丁目3番38号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
Application Number:
JP2010/000752
Publication Date:
August 11, 2011
Filing Date:
February 08, 2010
Export Citation:
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Assignee:
TOYO ADVANCED TECHNOLOGIES CO., LTD. (3-38, Ujina-higashi 5-chome Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
トーヨーエイテック株式会社 (〒01 広島県広島市南区宇品東5丁目3番38号 Hiroshima, 〒7348501, JP)
HOSHIYAMA, Toyohiro (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
星山豊宏 (〒01 広島県広島市南区宇品東5丁目3番38号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
IMAKURUSU, Shoji (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
International Classes:
B24B27/06; B28D5/04; H01L21/304
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Builing 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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Claims: