Title:
WIRE SAWING DEVICE FOR PRODUCING WAFERS
Document Type and Number:
WIPO Patent Application WO/2011/141543
Kind Code:
A1
Abstract:
The present invention relates to a wire sawing device (10) for producing wafers, in particular for the semiconductor and photovoltaic industry, wherein the wire sawing device (10) comprises a wire field (18) of a sawing wire (16) that can be moved in the longitudinal extent, wherein the movable sawing wire (16) runs around at least two spaced-apart guiding rollers (12), provided with guiding grooves (14), to form the wire field (18), whereby the sawing wire (16) is taken repeatedly back and forth parallel to itself and defines the wire field (18), wherein the sawing wire (16) is a continuous wire and wherein the sawing wire (16) is led back from a last guiding groove (14) to a first guiding groove (14) over precisely two deflecting rollers (20).
Inventors:
VOGEL, Thomas (Carl Haasstrasse 1, Schramberg, 78713, DE)
Application Number:
EP2011/057688
Publication Date:
November 17, 2011
Filing Date:
May 12, 2011
Export Citation:
Assignee:
VOGEL, Thomas (Carl Haasstrasse 1, Schramberg, 78713, DE)
International Classes:
B23D57/00; B28D5/04
Attorney, Agent or Firm:
DREISS PATENTANWÄLTE (Postfach 10 37 62, 70032 SuttgartGerokstr. 1, Stuttgart, 70188, DE)
Claims:
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