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Patent Searching and Data


Title:
WIRE TOOL WITH ABRASIVE GRAINS
Document Type and Number:
WIPO Patent Application WO/2014/065372
Kind Code:
A1
Abstract:
The wire tool (100) with abrasive grains comprises a wire (1), and abrasive grains (5) fixed by electrification hole plating (4) in electrification holes (3), which are provided at multiple spots on the outer circumferential surface of the wire (1). The cylindrical electrification holes (3) are disposed on a helical curve (30) separated from each other by a uniform gap (G) and the gap (G) is larger than 1/3 of the radius (R) of the electrification holes (3).

Inventors:
NAKAJIMA HIDETOSHI (JP)
SHIOYAMA KATSUNORI (JP)
TAKAIWA AKIHIRO (JP)
TANAKA KAZUAKI (JP)
SUZUKI SATORU (JP)
USHIODA TAKAHIRO (JP)
Application Number:
PCT/JP2013/078834
Publication Date:
May 01, 2014
Filing Date:
October 24, 2013
Export Citation:
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Assignee:
RIKEN CORUNDUM CO LTD (JP)
International Classes:
B24D11/00; B24B27/06; B24D3/00; B24D3/06
Domestic Patent References:
WO2010141206A22010-12-09
Foreign References:
US20110263187A12011-10-27
JP2009066689A2009-04-02
JP2011140095A2011-07-21
JPH0796454A1995-04-11
Attorney, Agent or Firm:
KOBAYASHI, Hisao et al. (JP)
Hisao Kobayashi (JP)
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