Title:
WIRELESS APPARATUS AND MEASUREMENT METHOD FOR MEASURING GAP BETWEEN FOCUS RING AND WAFER EDGE
Document Type and Number:
WIPO Patent Application WO/2023/216821
Kind Code:
A1
Abstract:
An apparatus (1) for measuring a gap between a wafer and a focus ring. The apparatus comprises a wafer and is used for measuring a gap between the wafer and a focus ring (2), and at least the following apparatuses are arranged on the wafer: a gap measurement module (4), which is used for measuring the gap distance between a wafer edge and the focus ring (2); and a gap collection module (5), which is connected to the gap measurement module (4), and is used for collecting measurement information of the gap measurement module (4), and transmitting the measurement information to an upper computer (11). Further provided are an adaptive measurement system and a measurement method. In-situ measurement of a gap between a wafer and a focus ring can be performed, thereby omitting a calibration positioning cavity, and thus saving space; and real-time in-place detection can be realized.
Inventors:
XIA ZIHUAN (CN)
LIU ZEHONG (CN)
DENG CHENHUI (CN)
LIAN CHAO (CN)
LIU ZEHONG (CN)
DENG CHENHUI (CN)
LIAN CHAO (CN)
Application Number:
PCT/CN2023/089110
Publication Date:
November 16, 2023
Filing Date:
April 19, 2023
Export Citation:
Assignee:
SHANGHAI GND ETECH CO LTD (CN)
International Classes:
G01B11/14; H01J37/32; H01L21/67
Foreign References:
| CN113670207A | 2021-11-19 | |||
| CN109300816A | 2019-02-01 | |||
| CN114812419A | 2022-07-29 | |||
| CN218600486U | 2023-03-10 | |||
| CN112444210A | 2021-03-05 | |||
| CN113412534A | 2021-09-17 | |||
| CN114446751A | 2022-05-06 | |||
| US20180301322A1 | 2018-10-18 |
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