Title:
WIRELESS COMMUNICATION SUBSTRATE AND WIRELESS COMMUNICATION TAG
Document Type and Number:
WIPO Patent Application WO/2020/059154
Kind Code:
A1
Abstract:
This wireless communication substrate is provided with: a conductive mounted antenna part on which a wireless IC chip is mounted; an antenna body part on which is disposed an electrode that forms an electrical field coupling with the mounted antenna part, and which is disposed in the stacking direction with respect to the mounted antenna part; and a first insulating spacer part that is stacked between the mounted antenna part and the antenna body part.
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Inventors:
WADA KOJI (JP)
OKANO YOSHINOBU (JP)
WAKABAYASHI SHIN (JP)
OKANO YOSHINOBU (JP)
WAKABAYASHI SHIN (JP)
Application Number:
PCT/JP2018/035232
Publication Date:
March 26, 2020
Filing Date:
September 21, 2018
Export Citation:
Assignee:
YOMETEL CO LTD (JP)
International Classes:
G06K19/077; H01Q1/38
Domestic Patent References:
WO2016170750A1 | 2016-10-27 | |||
WO2018123432A1 | 2018-07-05 |
Foreign References:
JP2011250406A | 2011-12-08 | |||
JP2009135867A | 2009-06-18 | |||
JP2008123222A | 2008-05-29 | |||
JP2014021705A | 2014-02-03 | |||
JP2017158072A | 2017-09-07 |
Attorney, Agent or Firm:
SHIRASAKA & PATENT PARTNERS (JP)
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