Title:
WIRELESS IC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/043432
Kind Code:
A1
Abstract:
In the present invention, a wireless IC device is achieved which is capable of improving radiation gain and easily adjusting impedance without resulting in the size of the substrate being increased. The present invention is a wireless IC device comprising a multi-layer substrate in which substrate layers (11a, 11b, 11c, and 11d) are layered. The upper surface of the multi-layer substrate is referred to as a first main surface, and the lower layer as a second main surface. Upon the first main surface side of the multi-layer substrate, a wireless IC element (50) for processing high-frequency signals is provided, and upon the second main surface, a first emitter (41) which is coupled to the wireless IC element (50) through an energizing circuit (20) which includes first conductor layers (31a and 31b) is provided. In addition, upon the first main surface side, a second emitter (42) which is coupled to the first emitter (41) through second conductor layers (32a) and (32b) is provided.
Inventors:
DOKAI YUYA (JP)
OZAWA MASAHIRO (JP)
OZAWA MASAHIRO (JP)
Application Number:
PCT/JP2011/071795
Publication Date:
April 05, 2012
Filing Date:
September 26, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
DOKAI YUYA (JP)
OZAWA MASAHIRO (JP)
DOKAI YUYA (JP)
OZAWA MASAHIRO (JP)
International Classes:
H01Q1/38; G06K19/07; G06K19/077; H01Q7/00
Domestic Patent References:
| WO2009011154A1 | 2009-01-22 |
Foreign References:
| JP2008252517A | 2008-10-16 | |||
| JP2008294491A | 2008-12-04 | |||
| JP2007272264A | 2007-10-18 | |||
| JP2009260758A | 2009-11-05 |
Attorney, Agent or Firm:
MORISHITA Takekazu et al. (JP)
Takeichi Morishita (JP)
Takeichi Morishita (JP)
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Claims: