Title:
WIRELESS IC METAL CARD HAVING CLAD METAL STRUCTURE FORMED THEREIN, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/239108
Kind Code:
A1
Abstract:
A wireless IC metal card, according to an embodiment of the present invention, comprises: a first metal layer having a top surface in which a wireless IC chip is accommodated; an antenna layer arranged on a partial region of the bottom surface of the first metal layer and electrically connected to the wireless IC chip; a second metal layer arranged below the first metal layer with the antenna layer therebetween; and a third metal layer arranged below the second metal layer, wherein the first metal layer, the second metal layer, and the third metal layer are bonded to one another to form a clad metal structure.
Inventors:
JEONG YOUNG HOON (KR)
YANG JAE MIN (KR)
NAM KI SUNG (KR)
YANG JAE MIN (KR)
NAM KI SUNG (KR)
Application Number:
PCT/KR2023/007509
Publication Date:
December 14, 2023
Filing Date:
June 01, 2023
Export Citation:
Assignee:
KONA M CO LTD (KR)
International Classes:
G06K19/077; B32B15/01; B32B15/18; B32B15/20; B32B37/02; B32B37/12; C22C9/06; C22C21/12; C22C38/18
Foreign References:
| KR20200004851A | 2020-01-14 | |||
| KR20210018995A | 2021-02-19 | |||
| KR20210050644A | 2021-05-10 | |||
| KR20170120524A | 2017-10-31 | |||
| KR20210018504A | 2021-02-17 |
Attorney, Agent or Firm:
POLARIS INTERNATIONAL PATENT & LAW FIRM (KR)
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