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Patent Searching and Data


Title:
WIRELESS IC TAG JOINING METHOD, WIRELESS IC TAG-CARRYING ARTICLE, AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2005/021292
Kind Code:
A1
Abstract:
Unvulcanized rubber equivalent in quality to unvulcanized rubber used on an article to be attached is provided on the surface of an IC tag (1) provided with a data storing means and a data transmitting means and formed in a flat shape, the opposite surface of the IC tag is mounted to the article before vulcanized, and the IC tag-mounted article is vulcanized as it is to fix the IC tag to the article. Accordingly, an IC tag even if mounted to an article such as a tire under a rigorous application environment will not be damaged.

Inventors:
KAWAI WAKAHIRO
Application Number:
PCT/JP2004/012213
Publication Date:
March 10, 2005
Filing Date:
August 25, 2004
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
KAWAI WAKAHIRO
International Classes:
B29C33/02; B29C35/02; B60C19/00; B60C23/04; G06K19/02; B29L30/00; (IPC1-7): B60C19/00; G06K19/00
Foreign References:
JPH09509488A1997-09-22
JP2002214060A2002-07-31
JP2001156110A2001-06-08
JP2001525283A2001-12-11
JP2002324281A2002-11-08
JP2004013449A2004-01-15
JP2003302290A2003-10-24
US20020093422A12002-07-18
Other References:
See also references of EP 1685984A4
Attorney, Agent or Firm:
Hara, Kenzo (Daiwa Minamimorimachi Building, 2-6, Tenjinbashi2-chome Kita,, Kita-k, Osaka-shi Osaka 41, JP)
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