A WIRELESS TELEMETRY ELECTRONIC CIRCUIT BOARD FOR HIGH TEMPERATURE ENVIRONMENTS

WIPO Patent Application WO/2010/036433

A3

A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed

MITCHELL DAVID J (US)
KULKARNI ANAND A (US)
SUBRAMANIAN RAMESH (US)
ROESCH EDWARD R (US)
WAITS ROD (US)
SCHUPBACH ROBERTO (US)
FRALEY JOHN R (US)
LOSTETTER ALEXANDER B (US)
MCPHERSON BRICE (US)
WESTERN BRYON (US)

PCT/US2009/048826

July 01, 2010

June 26, 2009

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SIEMENS ENERGY INC (US)
ARKANSAS POWER ELECTRONICS INT (US)
MITCHELL DAVID J (US)
KULKARNI ANAND A (US)
SUBRAMANIAN RAMESH (US)
ROESCH EDWARD R (US)
WAITS ROD (US)
SCHUPBACH ROBERTO (US)
FRALEY JOHN R (US)
LOSTETTER ALEXANDER B (US)
MCPHERSON BRICE (US)
WESTERN BRYON (US)

H05K3/32; H05K1/09; H05K3/34

US5821627A	1998-10-13
EP0009245A1	1980-04-02
EP0804990A1	1997-11-05
JPH0266952A	1990-03-07
EP1100296A1	2001-05-16

RYAN, Daniel, J. et al. (170 Wood Avenue SouthIselin, New Jersey, US)

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