Title:
WIRING BOARD, ELECTRONIC DEVICE AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2016/047755
Kind Code:
A1
Abstract:
This wiring board (1) comprises: an insulating base (11) having a cut portion (12) that opens to the main surface and the lateral surface; and an inner electrode (13) which is provided on the inner surface of the cut portion (12) and comprises a plurality of metal layers. The inner electrode (13) comprises, as an inner layer, at least one metal layer (17b) that is selected from among a nickel layer, a chromium layer, a platinum layer and a titanium layer, while comprising a gold layer as an outermost layer (17a). The metal layer (17b) is exposed in the outer peripheral portion of the inner electrode (13).
Inventors:
MORITA YUKIO (JP)
SUGIMOTO KENJI (JP)
SUGIMOTO KENJI (JP)
Application Number:
PCT/JP2015/077102
Publication Date:
March 31, 2016
Filing Date:
September 25, 2015
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H01L23/04; H05K1/11
Foreign References:
| JP2014127678A | 2014-07-07 | |||
| JP2013065602A | 2013-04-11 | |||
| JP2000323601A | 2000-11-24 |
Other References:
See also references of EP 3200223A4
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