Title:
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/131866
Kind Code:
A1
Abstract:
Provided are: a wiring board which can be easily miniaturized while maintaining the strength thereof; an electronic device; and an electronic module. This wiring board is provided with: an insulation substrate having a recess section in one surface thereof; and an electrical wiring structure. In the insulation substrate, a frame part, which constitutes side surfaces connecting an opened surface and a bottom surface of the recess section, has therein a first conductive portion having a plate shape.
Inventors:
KISAKI TAKUO (JP)
SASAKI TAKAHIRO (JP)
SASAKI TAKAHIRO (JP)
Application Number:
PCT/JP2018/048106
Publication Date:
July 04, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H03H9/02; H05K3/40
Foreign References:
| JP2010098227A | 2010-04-30 | |||
| JP2017098400A | 2017-06-01 | |||
| JP2000312060A | 2000-11-07 | |||
| JP2009111124A | 2009-05-21 |
Other References:
See also references of EP 3734653A4
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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