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Title:
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/146658
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure is provided with: an insulation substrate having a main surface; and an external connection conductor, a portion of which is located inside the insulation substrate and another portion of which is exposed to the main surface side, wherein the insulation substrate comprises a biting portion which has an insulation property and bites into the external connection conductor.

Inventors:
KISAKI TAKUO (JP)
SAWADA KEISUKE (JP)
Application Number:
PCT/JP2019/002129
Publication Date:
August 01, 2019
Filing Date:
January 23, 2019
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H03B5/32; H03H9/02; H05K3/34
Foreign References:
JP2005209881A2005-08-04
JP2013214721A2013-10-17
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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