WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Title:

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Document Type and Number:

WIPO Patent Application WO/2020/218326

Kind Code:

A1

Abstract:

Provided are: a wiring board which facilitates aligning of the relative angles of a plurality of electronic components with high accuracy and implementation of the plurality of electronic components on a module board with high positional accuracy; an electronic device having the wiring board; and an electronic module. A wiring board provided with an insulating base member and a wiring conductor positioned on the base member. The base member comprises a first surface; a fourth surface positioned opposite to the first surface; and a second surface and a third surface which are positioned on side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are each an electronic component-mounting surface, and the fourth surface is an implementation surface. The electronic device is provided with the wiring board and electronic components respectively mounted on the first surface, the second surface, and the third surface.

Inventors:

ITOU SEIICHIROU (JP)
NISHIUCHI REIKA (JP)

Application Number:

PCT/JP2020/017306

Publication Date:

October 29, 2020

Filing Date:

April 22, 2020

Export Citation:

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Assignee:

KYOCERA CORP (JP)

International Classes:

H01L23/12; G01P15/08; G01P15/18; H05K1/02; H05K1/18

Domestic Patent References:

WO2013015327A1

2013-01-31

Foreign References:

JP2004247699A	2004-09-02
JP2003028646A	2003-01-29
JP2001102746A	2001-04-13
JP2001156422A	2001-06-08
JP2016051709A	2016-04-11
JP2008185343A	2008-08-14

Other References: