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Title:
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2021/085587
Kind Code:
A1
Abstract:
This wiring board is provided with: an insulation board having a first surface; and a wiring conductor located in the insulation board. The insulation board includes a plurality of SiC bulk crystallites having different polytypes from one another. This electronic device is provided with the wiring board and an electronic component mounted on the wiring board. This electronic module is provided with the electronic device and a module board on which the electronic device is mounted.

Inventors:
ITOU SEIICHIROU (JP)
ISHIZAKI YUICHIRO (JP)
UMEKI HARUKI (JP)
Application Number:
PCT/JP2020/040774
Publication Date:
May 06, 2021
Filing Date:
October 30, 2020
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/12; H01L23/13; H01L23/14; H01L23/15; H01L23/36; H01L23/373; H01L33/64; H01S5/024; H05K1/02
Domestic Patent References:
WO2016017319A12016-02-04
Foreign References:
JP2007269627A2007-10-18
JP2004289011A2004-10-14
JP2019062212A2019-04-18
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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