Title:
WIRING BOARD AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/157478
Kind Code:
A1
Abstract:
A wiring board 10 is provided with: an insulating substrate 11, which is provided with a surface-mounting component mounting surface 10A, i.e., a first main surface, and a rear surface 10B, i.e., a second main surface on the reverse side of the first main surface, and which has a surface-mounting component mounting region Ra wherein a power element 20 is mounted on the surface-mounting component mounting surface 10A; a first conductor layer 12 formed on the surface-mounting component mounting surface 10A; and a second conductor layer 13 formed on the rear surface 10B. The first conductor layer 12, excluding a first region to be an electrically connecting region, is covered with a resist layer 16, and the second conductor layer 13, excluding a second region to be an electrically connecting region, is covered with the resist layer 16. Directly under the surface-mounting component mounting region Ra, the first conductor layer 12 on the surface-mounting component mounting surface 10A side is connected to the second conductor layer 13 via a via hole 14A penetrating the insulating substrate 11, and the first and second conductor layers 12, 13 connected via the via hole 14 have a heat dissipating region, which is exposed from the resist layer 16, and is covered with a solder layer 15.
Inventors:
KOMORI ATSUSHI (JP)
KAI AKIHIRO (JP)
KAI AKIHIRO (JP)
Application Number:
PCT/JP2015/060388
Publication Date:
October 06, 2016
Filing Date:
April 01, 2015
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H05K1/02
Foreign References:
| JP2008078271A | 2008-04-03 | |||
| JP2006100483A | 2006-04-13 | |||
| JP2012054162A | 2012-03-15 |
Attorney, Agent or Firm:
TAKAMURA, JUN (JP)
Jun Takamura (JP)
Jun Takamura (JP)
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