Title:
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/010753
Kind Code:
A1
Abstract:
Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.
Inventors:
OHMI TADAHIRO (JP)
GOTO TETSUYA (JP)
GOTO TETSUYA (JP)
Application Number:
PCT/JP2009/059838
Publication Date:
January 28, 2010
Filing Date:
May 29, 2009
Export Citation:
Assignee:
UNIV TOHOKU NAT UNIV CORP (JP)
DAISHO DENSHI CO LTD (JP)
OHMI TADAHIRO (JP)
GOTO TETSUYA (JP)
DAISHO DENSHI CO LTD (JP)
OHMI TADAHIRO (JP)
GOTO TETSUYA (JP)
International Classes:
H05K3/38; H05K1/11; H05K3/18; H05K3/42
Foreign References:
| JPH03259594A | 1991-11-19 | |||
| JP2008166420A | 2008-07-17 | |||
| JP2000216534A | 2000-08-04 | |||
| JP2003218516A | 2003-07-31 | |||
| JP2004162098A | 2004-06-10 |
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
Noriyasu Ikeda (JP)
Noriyasu Ikeda (JP)
Download PDF: