WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Title:

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2014/045491

Kind Code:

A1

Abstract:

Provided is a wiring board having excellent reliability in connection with a semiconductor chip. On the board main surface (11) side of an organic wiring board (10), a first build-up layer (31) is formed, said build-up layer having laminated therein resin insulating layers (21, 22) and conductor layers (24). A conductor layer (24), i.e., the topmost layer of the first build-up layer (31), includes a plurality of connecting terminal sections (41) for flip-chip mounting a semiconductor chip. Each of the connecting terminal sections (41) is exposed through an opening (43) in a solder resist layer (25). Each of the connecting terminal sections (41) has a semiconductor chip connecting region (51), and a wiring region (52) that extends in the planar direction from the connecting region (51). The solder resist layer (25) has, in the opening (43), a side-surface covering section (55) that covers the side surface of each of the connecting terminal sections (41), and a protruding wall section (56), which is integrally formed with the side-surface covering section (55), and which protrudes to intersect the connecting region (51).

Inventors:

HAYASHI TAKAHIRO (JP)
NAGAI MAKOTO (JP)
MORI SEIJI (JP)
NISHIDA TOMOHIRO (JP)
WAKAZONO MAKOTO (JP)
ITO TATSUYA (JP)

Application Number:

PCT/JP2013/003137

Publication Date:

March 27, 2014

Filing Date:

May 17, 2013

Export Citation:

Click for automatic bibliography generation Help

Assignee:

NGK SPARK PLUG CO (JP)

International Classes:

H01L21/60; H01L23/12; H05K3/34; H05K3/46

Foreign References:

JPS534468A	1978-01-17
JPH07321151A	1995-12-08
JP2001156203A	2001-06-08
JPS48112955U	1973-12-24
JPH11340277A	1999-12-10
JPS5239373A	1977-03-26
JP2001320168A	2001-11-16
JP2008147458A	2008-06-26

Other References: