WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Title:

WIRING BOARD AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2021/132479

Kind Code:

A1

Abstract:

Provided are: a novel wiring board having flexibility derived from a resin substrate, high electrical conductivity derived from a metal wiring, and high adhesion between the metal wiring and the resin substrate having insulating properties; and a method for manufacturing the wiring board without using a photolithography step.　A wiring board according to the present invention has a resin substrate and a metal wiring. The metal wiring includes a sintered body of metal particles. The sintered body has a plurality of gaps provided with openings facing the resin substrate. A part of the resin substrate enters the gaps through the openings.

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Inventors:

KOIKE JUNICHI (JP)
HOANG TRI HAI (JP)

Application Number:

PCT/JP2020/048490

Publication Date:

July 01, 2021

Filing Date:

December 24, 2020

Export Citation:

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Assignee:

MAT CONCEPT INC (JP)

International Classes:

H05K3/20; H05K3/38

Foreign References:

JP2005322834A	2005-11-17
JP2016110690A	2016-06-20
JP2004281658A	2004-10-07

Attorney, Agent or Firm:

IWAIKE Mitsuru et al. (JP)

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