Title:
WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/189790
Kind Code:
A1
Abstract:
This wiring board comprises: a base having elasticity that includes a first surface and a second surface positioned on the side opposite to the first surface; a wiring positioned at the first surface side of the base; and a stress relief layer that is positioned between the first surface of the base and the wiring, and that has an elastic modulus smaller than that of the base.
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Inventors:
OKIMOTO NAOKO (JP)
NAGAE MITSUTAKA (JP)
OGAWA KENICHI (JP)
SAKATA MAKIKO (JP)
MIYOSHI TORU (JP)
NAGAE MITSUTAKA (JP)
OGAWA KENICHI (JP)
SAKATA MAKIKO (JP)
MIYOSHI TORU (JP)
Application Number:
PCT/JP2020/012529
Publication Date:
September 24, 2020
Filing Date:
March 19, 2020
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K1/02
Foreign References:
| JP2017168437A | 2017-09-21 | |||
| JP2011108717A | 2011-06-02 | |||
| JP2016219543A | 2016-12-22 | |||
| JP2017513237A | 2017-05-25 | |||
| JP2013187308A | 2013-09-19 | |||
| JP2007281406A | 2007-10-25 | |||
| JP2013187308A | 2013-09-19 | |||
| JP2007281406A | 2007-10-25 |
Other References:
See also references of EP 3944727A4
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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