Title:
WIRING BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2011/052358
Kind Code:
A1
Abstract:
A wiring board (1000) is provided with a first rigid wiring board (10) having a first wiring layer (300b) on a first main surface, a second rigid wiring board (20) having a second wiring layer (300b) on a second main surface, a first connecting unit (P2) for connecting the first wiring layer with the second wiring layer, and a first interlayer insulating layer (302) formed on the first wiring layer, the second wiring layer, and the first connecting unit. The first rigid wiring board (10) and the second rigid wiring board (20) are disposed so that the first main surface and the second main surface are approximately at the same height, and the first wiring layer (300b) and the second wiring layer (300b) are electrically connected via the first connecting unit (P2).
Inventors:
NAGANUMA NOBUYUKI (JP)
Application Number:
PCT/JP2010/067693
Publication Date:
May 05, 2011
Filing Date:
October 07, 2010
Export Citation:
Assignee:
IBIDEN CO LTD (JP)
NAGANUMA NOBUYUKI (JP)
NAGANUMA NOBUYUKI (JP)
International Classes:
H05K3/46; H05K1/14
Foreign References:
| JP2004087786A | 2004-03-18 | |||
| JP2000091752A | 2000-03-31 | |||
| JPH01183196A | 1989-07-20 | |||
| JPS58105587A | 1983-06-23 | |||
| JPH10284632A | 1998-10-23 | |||
| JPH11317582A | 1999-11-16 | |||
| JP2007318090A | 2007-12-06 | |||
| JP2003069229A | 2003-03-07 | |||
| JP2003218523A | 2003-07-31 |
Attorney, Agent or Firm:
KIMURA MITSURU (JP)
Mitsuru Kimura (JP)
Mitsuru Kimura (JP)
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