Title:
WIRING BOARD, MODULE, AND IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/199885
Kind Code:
A1
Abstract:
This wiring board comprises: a board having a first surface and a second surface positioned on the opposite side to the first surface; a plurality of mesh wiring portions which are spaced apart from each other and are arranged on the first surface of the board; and a feed unit which is electrically connected to the mesh wiring portions. The wiring board has an electromagnetic wave transmitting/receiving function. The board has transparency. The mesh wiring portions are configured as an antenna. In the feed unit, a plurality of linearly extending first cut-out portions are formed.
Inventors:
TAKE SEIJI (JP)
IIMURA KEITA (JP)
KOIWA MITSUMASA (JP)
YAMAMOTO HIROSHI (JP)
IIOKA HIDETOSHI (JP)
NAKANO KOICHI (JP)
MARUYAMA YUYA (JP)
KOBAYASHI KENTA (JP)
KAI ERIKO (JP)
AONO KANARI (JP)
IIMURA KEITA (JP)
KOIWA MITSUMASA (JP)
YAMAMOTO HIROSHI (JP)
IIOKA HIDETOSHI (JP)
NAKANO KOICHI (JP)
MARUYAMA YUYA (JP)
KOBAYASHI KENTA (JP)
KAI ERIKO (JP)
AONO KANARI (JP)
Application Number:
PCT/JP2023/014524
Publication Date:
October 19, 2023
Filing Date:
April 10, 2023
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01Q1/38; H01Q1/22; H01Q1/44; H01Q21/08; H05K1/02
Domestic Patent References:
| WO2006106982A1 | 2006-10-12 |
Foreign References:
| JP2020178208A | 2020-10-29 | |||
| JP2011205635A | 2011-10-13 | |||
| JP2017143474A | 2017-08-17 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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