Title:
WIRING BOARD AND PROBE CARD INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2017/169761
Kind Code:
A1
Abstract:
The purpose of the invention is to improve measurement accuracy at the time of nondestructively measuring, in a wiring board having an electrode made of a plurality of plating layers, the thickness of each plating layer of the electrode by using a fluorescent X-ray film thickness meter. This wiring board 1 has an electrode 3 formed on a principal surface 2a of a core substrate 2. The electrode 3 is formed by sequentially layering a Cu plating layer 3a, a Ni plating layer 3b, and an Au plating layer 3c. A recess 5 is formed in the Au plating layer 3c. The bottom and the side surfaces of the recess 5 and the surface of the electrode 3 are covered by an Au film 3d formed of an Au plating having a different film quality from the Au plating layer 3c. By emitting X-rays from the bottom of the recess 5, it is possible to improve the accuracy of measuring the thickness of the Cu plating layer 3a and the Ni plating layer 3c which are on the inner-layer side of the electrode 3.
Inventors:
HATASE MINORU (JP)
MIZUSHIRO MASAAKI (JP)
MIZUSHIRO MASAAKI (JP)
Application Number:
PCT/JP2017/010317
Publication Date:
October 05, 2017
Filing Date:
March 15, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; G01R1/073; H01L21/66; H05K3/24
Foreign References:
| JP2002076591A | 2002-03-15 | |||
| JPH09148697A | 1997-06-06 | |||
| JP2000039452A | 2000-02-08 | |||
| JP2009099790A | 2009-05-07 |
Attorney, Agent or Firm:
YANASE, Yuji et al. (JP)
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