Title:
WIRING BOARD, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/092328
Kind Code:
A1
Abstract:
Provided is a wiring board 1 which is provided with: a stretchable resin layer 3; and a conductor foil 5 which is provided on the stretchable resin layer 3, and which forms a wiring pattern.
Inventors:
YAMADA KUNPEI (JP)
KAWAMORI TAKASHI (JP)
SIM TANGYII (JP)
KAWAMORI TAKASHI (JP)
SIM TANGYII (JP)
Application Number:
PCT/JP2017/016024
Publication Date:
May 24, 2018
Filing Date:
April 21, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H05K1/02; B32B15/04; B32B25/04; B32B25/14; B32B25/16; B32B25/18; C08F2/46; C08L21/00; H05K1/03
Domestic Patent References:
| WO2016080346A1 | 2016-05-26 |
Foreign References:
| JP2013187380A | 2013-09-19 | |||
| JP2000151030A | 2000-05-30 | |||
| JPH0590739A | 1993-04-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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