Title:
WIRING BOARD AND PRODUCTION METHOD FOR WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2019/107476
Kind Code:
A1
Abstract:
A wiring board that comprises: a transparent substrate; a plurality of first wirings that are arranged on an upper surface of the substrate, extend in a first direction, and have back surfaces that contact the substrate and front surfaces that face away from the back surfaces; and a second wiring that is arranged on the upper surface of the substrate, extends in a second direction that intersects the first direction, and has a back surface that contacts the substrate and a front surface that faces away from the back surface. The first wirings have pairs of side surfaces that extend in the first direction and abut the back surfaces of the first wirings. The pairs of side surfaces of the first wiring are sunken inward. The second wiring has a pair of side surfaces that extend in the second direction and abut the back surface of the second wiring. The pair of side surfaces of the second wiring are sunken inward.
Inventors:
SUZUKI KOICHI (JP)
TAKE SEIJI (JP)
MATSUURA DAISUKE (JP)
TAKE SEIJI (JP)
MATSUURA DAISUKE (JP)
Application Number:
PCT/JP2018/043909
Publication Date:
June 06, 2019
Filing Date:
November 29, 2018
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H05K1/02; H01Q1/00; H05K3/18
Domestic Patent References:
| WO2015156316A1 | 2015-10-15 |
Foreign References:
| JP2017123387A | 2017-07-13 | |||
| JP2011205635A | 2011-10-13 | |||
| JP2015046034A | 2015-03-12 | |||
| JP2001318454A | 2001-11-16 | |||
| JP2007142092A | 2007-06-07 | |||
| JP2017162262A | 2017-09-14 | |||
| JP2016015428A | 2016-01-28 | |||
| JP2017175540A | 2017-09-28 | |||
| JP2007089109A | 2007-04-05 | |||
| JP2011066610A | 2011-03-31 | |||
| JPS5636735B2 | 1981-08-26 | |||
| JP5695947B2 | 2015-04-08 |
Other References:
See also references of EP 3720256A4
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
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