Title:
WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/199030
Kind Code:
A1
Abstract:
This wiring board (11), which is provided in order to improve the manufacturing efficiency of a semiconductor device, is provided with: a transparent supporting body (12); an adhesive layer (13) having a release layer (41), which is arranged on a main surface (12a) of the supporting body (12) and contains a third resin that is decomposable by irradiation of light, and a protective layer (42) which is arranged on the release layer (41) and contains a fourth resin; and a laminate (21) which is arranged on the adhesive layer (13) and comprises a first resin layer (14), a second resin layer (19) that is arranged on the first resin layer (14), and a wiring pattern (18) that is arranged at least between the first resin layer (14) and the second resin layer (19). Consequently, a semiconductor chip (22) and the wiring board (11), which is an external connection member, are able to be manufactured separately, thereby improving the manufacturing efficiency of a semiconductor device (1).
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Inventors:
KOBAYASHI AKANE (JP)
AKUTAGAWA YOSHITO (JP)
AKUTAGAWA YOSHITO (JP)
Application Number:
PCT/JP2015/067892
Publication Date:
December 30, 2015
Filing Date:
June 22, 2015
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H01L23/12; C09J7/22; C09J201/00; H05K3/00
Foreign References:
| JP2012069734A | 2012-04-05 | |||
| JP2010010644A | 2010-01-14 | |||
| JP2012069919A | 2012-04-05 |
Other References:
See also references of EP 3163607A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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