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Patent Searching and Data


Title:
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/111966
Kind Code:
A1
Abstract:
Provided is a wiring board that, even when, for example, a thin glass substrate of substrate thickness is used as a core substrate therefor, has no glass breakage during the production process and has stable electrical properties for a capacitor. In order to achieve same, a glass wiring board (100) includes an analog duplexer including an inductor (5) and a capacitor (11) and has: the coil-structure inductor (5) including a through electrode (3) and a wiring pattern (4) that are provided on a glass substrate (10) via an inorganic adhesion layer (2); a core wiring board (110) having a land pattern (4a) that connects to an outer layer; the capacitor (11) having a structure interposing a dielectric layer (8) between upper and lower electrode patterns (7, 9), upon an insulating resin layer (6) of the core wiring board (110) coated in the insulating resin layer (6); and a wiring pattern (14) for connecting to an external component such as an external substrate.

Inventors:
IMAYOSHI KOJI (JP)
Application Number:
PCT/JP2018/044778
Publication Date:
June 13, 2019
Filing Date:
December 05, 2018
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H01L23/12; H01F27/00; H01G4/40; H01L23/15; H01L25/00; H03H7/00; H05K3/46
Domestic Patent References:
WO2013164926A12013-11-07
Foreign References:
JP2009518953A2009-05-07
JP2016502261A2016-01-21
JP2017073424A2017-04-13
JP2001126946A2001-05-11
JP2006060119A2006-03-02
Other References:
See also references of EP 3723120A4
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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