Title:
WIRING BOARD AND SOLID-STATE IMAGE PICKUP DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/131189
Kind Code:
A1
Abstract:
A wiring board (1) is provided with: an image pickup element (3) that is provided on one surface of a substrate (2); a reinforcing plate (4) that is provided at a position overlapping the image pickup element (3) by having the substrate (2) therebetween; and an adhesive layer (5) formed between the reinforcing plate (4) and the substrate (2) for the purpose of adhering the reinforcing plate (4) to the substrate (2). A through hole (7) reaching the adhesive layer (5) is formed in the reinforcing plate (4).
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| JP2021101491 | PHOTODETECTOR AND ELECTRONIC APPARATUS |
Inventors:
OHARA YOSHIKAZU
Application Number:
PCT/JP2017/022739
Publication Date:
July 19, 2018
Filing Date:
June 20, 2017
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H04N5/369; H01L27/146; H04N5/225; H05K1/02
Foreign References:
| JPH0363969U | 1991-06-21 | |||
| JP2008306350A | 2008-12-18 | |||
| JPS62219993A | 1987-09-28 | |||
| JPH09172103A | 1997-06-30 | |||
| JP2010192546A | 2010-09-02 | |||
| JP2015185622A | 2015-10-22 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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