Title:
WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2010/038489
Kind Code:
A1
Abstract:
In a wiring board (1) with a built-in electronic component, an electronic component (3) is stored in a through hole (21) arranged on a core substrate (2). On one main surface (first surface) of the core board (2), an interlayer insulating layer (6) is formed, and on the other main surface (second surface) of the core substrate (2), a conductor pattern (5), a conductor pattern (10) and an interlayer insulating layer (7) are formed. Furthermore, on the interlayer insulating layer (6) and the interlayer insulating layer (7), a conductor pattern (8) and a conductor pattern (9) are formed, respectively. A terminal (30) of the electronic component (3) is electrically connected to the conductor pattern (8) through a via conductor (60) arranged on the interlayer insulating layer (6). The conductor pattern (10) has the same thickness as that of the conductor pattern (5), and is formed in a frame shape on the periphery of an end surface on the second surface side of the through hole (21).
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Application Number:
JP2009/054958
Publication Date:
April 08, 2010
Filing Date:
March 13, 2009
Export Citation:
Assignee:
IBIDEN CO., LTD. (2-1 Kanda-cho, Ogaki-shi Gifu, 04, 50386, JP)
International Classes:
H05K3/46
Attorney, Agent or Firm:
KIMURA, Mitsuru (2nd Floor, Kyohan Building 7, Kandanishiki-cho 2-chome, Chiyoda-k, Tokyo 54, 10100, JP)
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