Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/090583
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure has: an insulating layer 1 which is composed of an organic resin as a main component and includes inorganic particles; a first metal layer 3a disposed on a first face 1a of the insulating layer 1; and a second metal layer 3b disposed on a second face 1b opposite to the first face 1a. The insulating layer 1 has a thickness of 75-1000 μm, and a storage elastic modulus of 4-7 Gpa; the first metal layer 3a has a thickness of 1.5-10 μm, and a coverage ratio of 5-25%; the second metal layer 3b has a thickness of 3-10 μm, or 25-100 μm, and a coverage ratio of 85% or more; and a surface portion 1c of the insulating layer 1, on the side in which the first metal layer 3a is disposed, has a higher proportion of an organic resin than a surface portion 1d of the insulating layer 1 on the side in which the second metal layer 3b is disposed.
Inventors:
NAGASAWA TADASHI (JP)
YOSHIURA SATOSHI (JP)
YOSHIURA SATOSHI (JP)
Application Number:
PCT/JP2019/041523
Publication Date:
May 07, 2020
Filing Date:
October 23, 2019
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K1/03; B32B15/08; H01Q1/38; H01Q13/08; H01Q21/06; H05K1/16
Foreign References:
| JP2001111328A | 2001-04-20 | |||
| JP2015084394A | 2015-04-30 | |||
| JPH088639A | 1996-01-12 | |||
| JPH08307147A | 1996-11-22 |
Download PDF:
Previous Patent: MEASURING DEVICE
Next Patent: IMAGE DISPLAY DEVICE, IMAGE DISPLAY SYSTEM, AND MOVABLE BODY
Next Patent: IMAGE DISPLAY DEVICE, IMAGE DISPLAY SYSTEM, AND MOVABLE BODY