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Patent Searching and Data


Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/158868
Kind Code:
A1
Abstract:
The purpose is to provide a wiring board that has a dielectric line with a high transmission efficiency of high frequency waves. A wiring board is provided that comprises a dielectric line that includes resin (A) and a dielectric exterior unit that covers the dielectric line and includes resin (B), wherein the dielectric exterior unit has a relative permittivity at 6 GHz and 25°C lower than that of the dielectric line.

Inventors:
IKEDA TOMOHIRO (JP)
YOSHIMOTO HIROYUKI (JP)
YAMANAKA TAKU (JP)
Application Number:
PCT/JP2020/003447
Publication Date:
August 06, 2020
Filing Date:
January 30, 2020
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
H01P3/16
Domestic Patent References:
WO2016159314A12016-10-06
Foreign References:
JPH10163964A1998-06-19
US20160240907A12016-08-18
Other References:
ANONYMOUS: "Characteristics of PTFE ", SEALQUICKSEARCHER (ENGLISH), 1 January 2019 (2019-01-01), XP055726112, Retrieved from the Internet [retrieved on 20200323]
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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