Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/084860
Kind Code:
A1
Abstract:
A wiring board according to the present disclosure comprises: a first insulating layer and a second insulating layer; a first wiring conductor layer that is positioned between the first insulating layer and the second insulating layer, while comprising a first via land; a second wiring conductor layer that is positioned on the second insulating layer, while comprising a second via land; a via hole that penetrates the second insulating layer from the upper surface to the lower surface; and a via conductor that is positioned in the via hole and electrically connects the first via land and the second via land to each other. The via conductor is positioned on the inner surface of the via hole and on the first via land, with a first base layer containing nichrome and a second base layer containing the same metal as the via conductor being interposed therebetween, said second base layer being on the upper surface of the first base layer. An alloy layer, which contains tin, nichrome and the same metal as the first wiring conductor layer, is positioned between the first via land and the first base layer.
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Inventors:
YUGAWA HIDETOSHI (JP)
Application Number:
PCT/JP2020/031575
Publication Date:
May 06, 2021
Filing Date:
August 21, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05K3/42; H05K3/38; H05K3/46
Foreign References:
| JPH07147483A | 1995-06-06 | |||
| JP2016035969A | 2016-03-17 | |||
| JP2012074687A | 2012-04-12 |
Attorney, Agent or Firm:
BUNA PATENT ATTORNEYS (JP)
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