Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/176238
Kind Code:
A1
Abstract:
A wiring board (101) comprises a board (1) that includes a first insulation material as a principal material and has a first surface (1a) and a second surface (1b) that face opposite sides, a column-shaped first conductor layer (31) that stands on the first surface side (1a), a second conductor layer (32) that contacts an end of the first conductor layer (31) on the far side from the first surface (1a) and is wider than the first conductor layer (31) as seen from the direction perpendicular to the first surface (1a), a ring-shaped first insulation part (41) that is formed from the first insulation material or a second insulation material that has a thermal expansion coefficient close to the first insulation material as compared to the material of the first conductor layer (31) and surrounds the first conductor layer (31) as seen from the direction perpendicular to the first surface (1a), and a resist layer (4) that surrounds the outside of the first insulation part (41).
Inventors:
ASANO HIROYUKI (JP)
YAMAMOTO ISSEI (JP)
YAMAMOTO ISSEI (JP)
Application Number:
PCT/JP2023/004711
Publication Date:
September 21, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/28; H05K3/34
Domestic Patent References:
| WO2008114434A1 | 2008-09-25 | |||
| WO2013061946A1 | 2013-05-02 | |||
| WO2010001597A1 | 2010-01-07 |
Foreign References:
| JP2001196496A | 2001-07-19 | |||
| JP2014192177A | 2014-10-06 | |||
| JP2013055208A | 2013-03-21 | |||
| JP2018006391A | 2018-01-11 | |||
| JP2008021883A | 2008-01-31 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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