Title:
WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/048216
Kind Code:
A1
Abstract:
This wiring board (10) comprises a substrate part (11) and a conductor part (12). The substrate part (11) comprises a conductor layer (20) that has a wiring pattern (first wiring pattern (21)) and an insulation layer (30) that has an insulation film (32) covering part of the wiring pattern, wherein a partial area of the wiring pattern is configured as a land part (23). The conductor part (12) has a base material (40) and a plating layer (41). The base material (40) has a facing surface (42), a pair of first surfaces (43, 44), and a pair of second surfaces (45, 46). The facing surface (42) and the pair of first surfaces (43, 44) are covered by the plating layer (41). The pair of second surfaces (45, 46) have exposed surfaces (45A, 46A). The plating layer (41) covering the pair of first surfaces (43, 44) is joined to the land part (23). The pair of second surfaces (45, 46) are disposed so as to overlap the land part (23) in the thickness direction.
Inventors:
NAKAGUCHI SHINNOSUKE (JP)
Application Number:
PCT/JP2023/028879
Publication Date:
March 07, 2024
Filing Date:
August 08, 2023
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K1/02; H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| WO2022085572A1 | 2022-04-28 |
Foreign References:
| JPH0794838A | 1995-04-07 | |||
| JP2010251551A | 2010-11-04 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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