Title:
WIRING BODY, WIRING BOARD, TOUCH SENSOR AND METHOD FOR PRODUCING WIRING BODY
Document Type and Number:
WIPO Patent Application WO/2016/104723
Kind Code:
A1
Abstract:
This wiring body (1) is provided with a bonding layer (3) and a conductor pattern (41) that is bonded to the bonding layer (3). The surface roughness of a bonding surface (42) of the conductive conductor (41), said bonding surface being bonded to the bonding layer (3), is higher than the surface roughnesses of surfaces other than the bonding surface (42) of the conductor pattern (41).
Inventors:
HONDO TAKAHARU (JP)
Application Number:
PCT/JP2015/086271
Publication Date:
June 30, 2016
Filing Date:
December 25, 2015
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
G06F3/041; H05K3/12; H05K3/20; H05K3/38
Foreign References:
| JPH07169635A | 1995-07-04 | |||
| JPH04240792A | 1992-08-28 | |||
| JP2012185813A | 2012-09-27 | |||
| JP2011139097A | 2011-07-14 |
Other References:
See also references of EP 3190488A4
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
It can exceed and is a patent business corporation. (JP)
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