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Patent Searching and Data


Title:
WIRING BODY, WIRING BOARD AND TOUCH SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/123974
Kind Code:
A1
Abstract:
This wiring body 40 is provided with: a second resin part 70; a first conductor part 60 that is provided on one surface of the second resin part and comprises a first electrode part 61; and a second conductor part 80 that is provided on the other surface of the second resin part and comprises a second electrode part 81. The first electrode part comprises at least one first grid 612 which comprises a plurality of first thin wires 611 intersecting with each other, and which is formed of these first thin wires; and the second electrode part comprises at least one second grid 812 which comprises a plurality of second thin wires 811 intersecting with each other, and which is formed of these second thin wires. By arranging the first electrode part and the second electrode part to face each other, an overlapping region 41 where the first electrode part and the second electrode part partially overlap with each other and a non-overlapping region 42 other than the overlapping region are present in a perspective plan view. In the perspective plan view, the area occupied by the first fine wires or the second fine wires per unit area in the overlapping region in the first electrode part or the second electrode part is larger than the area occupied by the first fine wires or the second fine wires per unit area in the non-overlapping region. The first conductor part comprises a first dummy electrode part 63 which is positioned on the same plane as the first electrode part, while being electrically insulated from the first electrode part; and the first dummy electrode part is present within the at least one first grid in the non-overlapping region.

Inventors:
OGURA SHINGO (JP)
Application Number:
PCT/JP2017/046438
Publication Date:
July 05, 2018
Filing Date:
December 25, 2017
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
International Classes:
G06F3/041; G06F3/044; H05K1/02
Domestic Patent References:
WO2016002583A12016-01-07
WO2014119231A12014-08-07
WO2015156316A12015-10-15
Foreign References:
JP2014219986A2014-11-20
JP2016038753A2016-03-22
JP2015108884A2015-06-11
JP2016540304A2016-12-22
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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