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Patent Searching and Data


Title:
WIRING BODY, WIRING SUBSTRATE, AND TOUCH SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/208636
Kind Code:
A1
Abstract:
A wiring body 4 is provided with: an adhesion layer 5; a mesh-form electrode layer 6 provided on the adhesion layer, the mesh-form electrode layer 6 being formed from first conductor wires 64; a mesh-form first lead-out wiring layer 7 provided on the adhesion layer, the mesh-form first lead-out wiring layer 7 being formed from second conductor wires 74; and a linear boundary line 8 interposed between the mesh-form electrode layer and the first lead-out wiring layer, the line-shaped boundary line 8 contacting at least two first conductor wires, and contacting the end section 76 of the first lead-out wiring layer. Expressions (1) and (2) below are satisfied. W 1W3... (2) In expressions (1) and (2), W1 is the width of the first conductor wire, W2 is the width of the second conductor wire, L1 is the length in the extension direction of the boundary line, and W3 is the width of the end section of the first leadout wiring layer.

Inventors:
HAMMURA TETSU (JP)
Application Number:
PCT/JP2016/068554
Publication Date:
December 29, 2016
Filing Date:
June 22, 2016
Export Citation:
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Assignee:
FUJIKURA LTD (JP)
International Classes:
G06F3/041; G06F3/044
Domestic Patent References:
WO2014153897A12014-10-02
WO2014157632A12014-10-02
WO2014153898A12014-10-02
Foreign References:
JP2006302930A2006-11-02
JP2011096225A2011-05-12
JP2012168301A2012-09-06
JP2015515709A2015-05-28
JP2014207283A2014-10-30
JP2015079513A2015-04-23
JP2013152599A2013-08-08
JP2014135074A2014-07-24
Other References:
See also references of EP 3312707A4
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
It can exceed and is a patent business corporation. (JP)
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