Title:
WIRING CABLE CONNECTION STRUCTURE AND WIRING CABLE CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/155405
Kind Code:
A1
Abstract:
Provided are a wiring cable connection structure that enables a head part to be reduced in size, and a wiring cable connection method. The wiring cable connection structure is provided with a plurality of imaging elements formed on a surface, a semiconductor chip having a plurality of connection pads formed on a rear surface, and a wiring cable with which a plurality of wires are integrally formed, said plurality of wires being exposed from an end face. The plurality of connection pads of the semiconductor chip and the plurality of wires exposed from the end face are connected.
Inventors:
KAMEI TAKATOSHI (JP)
Application Number:
PCT/JP2013/001988
Publication Date:
October 02, 2014
Filing Date:
March 25, 2013
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
H04N5/225; H04N5/232
Foreign References:
| JP2011238458A | 2011-11-24 | |||
| JPH0990237A | 1997-04-04 | |||
| JP2011188375A | 2011-09-22 | |||
| JP2000232957A | 2000-08-29 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
Patent business corporation cherry tree international patent firm (JP)
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