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Patent Searching and Data


Title:
WIRING CABLE CONNECTION STRUCTURE AND WIRING CABLE CONNECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/155406
Kind Code:
A1
Abstract:
Provided are a wiring cable connection structure that enables a head part to be reduced in size, and a wiring cable connection method. The wiring cable connection structure: has a plurality of imaging elements formed on a surface, and a plurality of connection pads formed on a rear surface; and is provided with a semiconductor chip on which a first alignment mark is disposed, and a wiring cable with which a plurality of wires are integrally formed, and on which a second alignment mark corresponding to the first alignment mark is disposed. The semiconductor chip and the wiring cable are connected such that the position of the first alignment mark and the position of the second alignment mark correspond.

Inventors:
KAMEI TAKATOSHI (JP)
Application Number:
PCT/JP2013/001989
Publication Date:
October 02, 2014
Filing Date:
March 25, 2013
Export Citation:
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Assignee:
TOSHIBA KK (JP)
International Classes:
H04N5/232; H04N5/225
Foreign References:
JP2011238458A2011-11-24
JPH0990237A1997-04-04
JP2011188375A2011-09-22
JP2000232957A2000-08-29
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
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