WIRING CIRCUIT, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

Title:

WIRING CIRCUIT, WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2013/118229

Kind Code:

A1

Abstract:

Provided are a wiring circuit wherein a first electrode layer and a second electrode layer are stably electrically connected to each other, said first electrode layer and second electrode layer being formed by having therebetween a via hole formed in an insulating layer, and a method for forming the circuit. A wiring circuit of the embodiment of the present invention is characterized in that the via hole has, in the via hole, a hole that reaches the first electrode layer.

More Like This:

JP2002338652	AQUEOUS ALKALINE SOLUTION-SOLUBLE URETHANE FORMING EPOXYCARBOXYLATE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME AND ITS HARDENED MATERIAL
JPH05182861	MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC COMPONENT
JP3879783	MANUFACTURE OF MULTILAYER PRINTED BOARD

Inventors:

NAGANO TAKU (JP)
YOSHIDA TAKAHIRO (JP)
YANAGIDA NOBUYUKI (JP)

Application Number:

PCT/JP2012/008313

Publication Date:

August 15, 2013

Filing Date:

December 26, 2012

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TAIYO INK MFG CO LTD (JP)
NAGANO TAKU (JP)
YOSHIDA TAKAHIRO (JP)
YANAGIDA NOBUYUKI (JP)

International Classes:

H05K3/46; H05K1/11; H05K3/40

Domestic Patent References:

WO2008087890A1	2008-07-24
WO2004008818A1	2004-01-22

Foreign References:

JP2004165343A	2004-06-10
JP2000138454A	2000-05-16
JP2001007521A	2001-01-12

Attorney, Agent or Firm:

AMAGI INTERNATIONAL PATENT LAW OFFICE (JP)
Patent business corporation Amagi international patent firm (JP)

Download PDF:

View/Download PDF PDF Help

Claims:

Previous Patent: ABNORMALITY DETECTION APPARATUS AND ENVIRONMETAL TEST APPARATUS PROVIDED WITH SAME

Next Patent: POWER STORAGE DEVICE, AND METHOD FOR PRODUCING POLYMER AND NON-AQUEOUS SECONDARY BATTERY