Title:
WIRING CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, AND IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/065139
Kind Code:
A1
Abstract:
This method for manufacturing a wiring circuit board is provided with: a first step for providing, on one surface of a metal plate in the thickness direction, an insulating layer having an opening passing therethrough in the thickness direction; a second step for providing a first barrier layer by means of plating on the one surface, exposed from the opening, of the metal plate in the thickness direction; a third step for providing a second barrier layer in a continuous shape on one side of the first barrier layer in the thickness direction and on the inner surface of the insulating layer facing the opening; a fourth step for providing a conductor layer so that the conductor layer contacts the second barrier layer; and a fifth step for removing the metal plate by etching.
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Inventors:
SHIBATA SHUSAKU (JP)
TAKAKURA HAYATO (JP)
ITO MASAKI (JP)
KAWAMURA YOSHIHIRO (JP)
WAKAKI SHUICHI (JP)
TAKAKURA HAYATO (JP)
ITO MASAKI (JP)
KAWAMURA YOSHIHIRO (JP)
WAKAKI SHUICHI (JP)
Application Number:
PCT/JP2018/032998
Publication Date:
April 04, 2019
Filing Date:
September 06, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K3/42; H05K1/11; H05K3/40
Foreign References:
| JP2001044589A | 2001-02-16 | |||
| JP2009224750A | 2009-10-01 | |||
| JP2011181740A | 2011-09-15 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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