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Patent Searching and Data


Title:
WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/177078
Kind Code:
A1
Abstract:
This wiring circuit board is provided with: a first insulation layer; a wiring disposed on one surface, in the thickness direction, of the first insulation layer; a second insulation layer which covers the wiring; and a particle-containing layer which contains electrically conductive particles each having a shape, the aspect ratio of which is 2 or more, and which covers the wiring via the second insulation layer. The wiring has a substantially curved shape.

Inventors:
OKUMURA, Keisuke (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
FURUKAWA, Yoshihiro (1-2 Shimo-hozumi 1-chome, Ibaraki-sh, Osaka 80, 〒5678680, JP)
Application Number:
JP2019/010448
Publication Date:
September 19, 2019
Filing Date:
March 14, 2019
Export Citation:
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Assignee:
NITTO DENKO CORPORATION (1-2 Shimo-hozumi 1-chome, Ibaraki-shi Osaka, 80, 〒5678680, JP)
International Classes:
H01F17/00; H01F17/04; H01F38/14; H01F41/04; H05K1/16
Domestic Patent References:
WO2016199638A12016-12-15
Foreign References:
JPH1074626A1998-03-17
JP2008098406A2008-04-24
JP4431023B22010-03-10
JPS6392005A1988-04-22
JP2017037888A2017-02-16
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (Central Shin-Osaka Building 3rd Floor 5-36, Miyahara 4-chome, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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