Title:
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/054246
Kind Code:
A1
Abstract:
This wiring circuit board is sequentially provided with a conductor layer, an insulating layer and a shield layer toward one side in the thickness direction. The insulating layer covers the conductor layer, while having an insulating opening from which one surface of a part of the conductor layer in the thickness direction is exposed; and the shield layer has a recessed portion which is arranged within the insulating opening, and which sinks toward the other side in the thickness direction so as to be in contact with the conductor layer. The shield layer sequentially comprises an adhesion layer and a main body layer toward the one side in the thickness direction. The ratio of the thickness Tb of the main body layer to the thickness Ta of the adhesion layer, namely Tb/Ta is 4 or more.
Inventors:
KAWAMURA YOSHIHIRO (JP)
SHIBATA SHUSAKU (JP)
TAKAKURA HAYATO (JP)
ITO MASAKI (JP)
SHIBATA SHUSAKU (JP)
TAKAKURA HAYATO (JP)
ITO MASAKI (JP)
Application Number:
PCT/JP2018/032849
Publication Date:
March 21, 2019
Filing Date:
September 05, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K3/38; H05K1/02; H05K1/11; H05K3/40; H05K3/46
Foreign References:
| JPH04165696A | 1992-06-11 | |||
| JP2009278048A | 2009-11-26 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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