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Patent Searching and Data


Title:
WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/078106
Kind Code:
A1
Abstract:
This wiring circuit board is provided with: an insulation layer; wiring which is embedded in the insulation layer; and an alignment mark which is electrically independent from the wiring, and which is disposed in the insulation layer such that one surface in the thickness direction is exposed from the insulation layer. A peripheral portion of the alignment mark consists only of the insulation layer, and has a thickness of 30 µm or lower.

Inventors:
SHIBATA SHUSAKU (JP)
TAKANO TAKAHIRO (JP)
HARUTA HIROMOTO (JP)
WAKAKI SHUICHI (JP)
Application Number:
PCT/JP2018/038084
Publication Date:
April 25, 2019
Filing Date:
October 12, 2018
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/02
Foreign References:
JP2002185102A2002-06-28
JP2015195233A2015-11-05
JP2013093077A2013-05-16
JP2008081577A2008-04-10
JP2003304041A2003-10-24
JP2010128200A2010-06-10
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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