Title:
WIRING CIRCUIT AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/172023
Kind Code:
A1
Abstract:
The present invention addresses the issue of providing: a wiring circuit including graphite wiring having the required thickness for semiconductor wiring and having high electrical conductivity and high carrier mobility; and a production method therefor. The present invention is a wiring circuit including graphite wiring, having a wiring thickness of at least 3 nm and less than 300 nm, having an electrical conductivity in the film surface direction of the graphite of at least 18,000 S/cm, and having a carrier mobility in the graphite film surface direction of at least 9,500 cm2/Vsec. In addition, the present invention includes a wiring circuit production method having, in order: a bonding step (1) in which a graphite film and a substrate are bonded; a plasma etching step (2) in which the graphite film is formed into a graphite thin film by using plasma etching; and a wiring circuit formation step (3) in which the graphite thin film is etched and a wiring circuit is formed.
Inventors:
MURAKAMI MUTSUAKI (JP)
KAWASHIMA YUKI (JP)
KAWASHIMA YUKI (JP)
Application Number:
PCT/JP2019/007364
Publication Date:
September 12, 2019
Filing Date:
February 26, 2019
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
H01L21/3205; C01B32/21; H01L21/3065; H01L21/3213; H01L21/768; H01L23/532
Domestic Patent References:
| WO2015045641A1 | 2015-04-02 |
Foreign References:
| JP2011113797A | 2011-06-09 | |||
| JP2016025068A | 2016-02-08 | |||
| JP2012074682A | 2012-04-12 | |||
| JP2012060010A | 2012-03-22 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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