Title:
WIRING FAULT DETECTION METHOD, WIRING FAULT DETECTION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2013/031900
Kind Code:
A1
Abstract:
A wiring fault detection method according to one embodiment of the present invention is capable of determining that the corresponding pixel is faulty when the value of temperature increase of a faulty section exceeds the temperature increase threshold value within a frame number threshold value that has been set in advance. This wiring fault detection device is provided with a temperature measurement imaging unit for measuring and imaging the temperature of a semiconductor substrate.
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Inventors:
KARITA YUJI
Application Number:
PCT/JP2012/072021
Publication Date:
March 07, 2013
Filing Date:
August 30, 2012
Export Citation:
Assignee:
SHARP KK (JP)
KARITA YUJI
KARITA YUJI
International Classes:
G01N25/72
Foreign References:
| JPH06207914A | 1994-07-26 | |||
| JP2002350491A | 2002-12-04 | |||
| JP2003215081A | 2003-07-30 | |||
| JPH1114576A | 1999-01-22 | |||
| JP2001337059A | 2001-12-07 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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