Title:
WIRING FORMATION METHOD AND METHOD FOR MANUFACTURING TRANSFER MOLD
Document Type and Number:
WIPO Patent Application WO/2022/064729
Kind Code:
A1
Abstract:
Provided is a previously unknown and revolutionary wiring formation method that enables transfer wiring formation using a transfer mold without performing a flattening process on a substrate having protrusions and recesses in the surface. A wiring formation method in which: an electroconductive member 2 is filled into a recessed section 4a of a transfer mold 4 in which a prescribed pattern of the recessed section 4a is formed; the transfer mold 4 into which the electroconductive member 2 is filled is overlaid on the surface of a substrate 1 having the protrusions and recesses; and the electroconductive member 2 is transferred to the surface of the substrate 1 to form a wiring section 3 on the surface of the substrate 1 using the electroconductive member 2, wherein a transfer mold having a hardness of 40-70 on the durometer A hardness scale is used as the transfer mold 4.
More Like This:
| JP4416058 | How to make an embossed sheet and equipment |
| JPS60193685 | STAMP AND ITS MANUFACTURE |
| JPH06340053 | PRINTING PLATE AND PRINTING METHOD |
Inventors:
KOMATSU HIROSHI (JP)
SAKAI DAISUKE (JP)
SAKAI DAISUKE (JP)
Application Number:
PCT/JP2021/000514
Publication Date:
March 31, 2022
Filing Date:
January 08, 2021
Export Citation:
Assignee:
CONNECTEC JAPAN CORP (JP)
International Classes:
B41C1/08; B41M1/10; B41M1/34; H01L21/60; H05K3/20
Domestic Patent References:
| WO2015056483A1 | 2015-04-23 |
Foreign References:
| JP2011502194A | 2011-01-20 | |||
| JP2015182278A | 2015-10-22 | |||
| JP2016058664A | 2016-04-21 |
Attorney, Agent or Firm:
YOSHII Takeshi (JP)
Download PDF: