Title:
WIRING IMPLEMENT
Document Type and Number:
WIPO Patent Application WO/2018/131463
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a wiring implement that does not require high dimensional accuracy of a housing that houses a first substrate. This wiring implement (10) comprises a first substrate (5), a second substrate (6), a support member (4) and a housing (1). The second substrate (6) is electrically connected to the first substrate (5), and is aligned with the first substrate (5) in the insertion direction of a first external terminal (18) into a first internal terminal (8). The support member (4) is provided on the second substrate (6) side of the first substrate (5) in the insertion direction, and supports the first substrate (5). The support member (4) comprises a support part (41) and a contact part. The support part (41) supports the first substrate (5) from the second substrate (6) side in the insertion direction. The contact part contacts the housing (1) from the first substrate (5) side in the insertion direction.
Inventors:
WANG WEILI
AYA KENTA
AYA KENTA
Application Number:
PCT/JP2017/046617
Publication Date:
July 19, 2018
Filing Date:
December 26, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H02G3/12; H02G3/02; H05K7/14
Domestic Patent References:
| WO2013175942A1 | 2013-11-28 |
Foreign References:
| JP2015213206A | 2015-11-26 | |||
| US20160233621A1 | 2016-08-11 | |||
| JP2014154802A | 2014-08-25 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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