Title:
WIRING INSPECTING METHOD, WIRING INSPECTING APPARATUS, WIRING INSPECTING PROGRAM, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2013/046859
Kind Code:
A1
Abstract:
This wiring inspecting method is provided for the purpose of inspecting whether there is a short-circuited portion in wiring formed on a substrate. The wiring inspecting method includes: a heat generating step of having a short-circuited portion generate heat by applying a voltage to wiring by means of a voltage applying means (5); an image acquiring step of acquiring an infrared image of a substrate by means of an image pickup means (6); a binarizing step of generating, by means of an image processing means (7), a binarized image from the infrared image using a threshold value; and a position specifying step of specifying, by means of the image processing means (7), a position of the short-circuited portion from the binarized image. In the binarizing step, binarizing processing is repeated by changing the threshold value. Consequently, a thinned binarized image is generated by binarizing the infrared image of the wiring including the short-circuited portion, and the position of the short-circuited portion can be accurately specified.
More Like This:
Inventors:
YAMADA EIJI
Application Number:
PCT/JP2012/067629
Publication Date:
April 04, 2013
Filing Date:
July 10, 2012
Export Citation:
Assignee:
SHARP KK (JP)
YAMADA EIJI
YAMADA EIJI
International Classes:
G01N25/72; G01R31/02; G02F1/13; H05K3/00; G01N21/956
Foreign References:
| JPH0651011A | 1994-02-25 | |||
| JP2009156573A | 2009-07-16 | |||
| JPH09311106A | 1997-12-02 | |||
| JPH0658893A | 1994-03-04 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Download PDF:
Claims: