Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
WIRING MEMBER ATTACHMENT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2019/215995
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a technology that can achieve improvement of heat radiation property in attaching wiring members to a vehicle. This wiring member attachment structure is provided with: a metal member provided to a vehicle; and a wiring member which is formed flat and disposed so as to come into surface contact with the metal member and which connects electric components mounted to the vehicle. For example, the wiring member includes a plurality of electric wires and a sheet material having one main surface which is in surface contact with the metal member and the other main surface which has the plurality of electric wires provided thereon.

Inventors:
HASEGAWA Hitoshi (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 03, 〒5108503, JP)
FUKAMI Yuya (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 03, 〒5108503, JP)
MIZUSHITA Masaki (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 03, 〒5108503, JP)
YOKOI Motohiro (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 03, 〒5108503, JP)
MIZUNO Housei (1-14, Nishisuehiro-cho, Yokkaichi-sh, Mie 03, 〒5108503, JP)
Application Number:
JP2019/006825
Publication Date:
November 14, 2019
Filing Date:
February 22, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
AUTONETWORKS TECHNOLOGIES, LTD. (1-14, Nishisuehiro-cho Yokkaichi-sh, Mie 03, 〒5108503, JP)
SUMITOMO WIRING SYSTEMS, LTD. (1-14, Nishisuehiro-cho Yokkaichi-sh, Mie 03, 〒5108503, JP)
SUMITOMO ELECTRIC INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
B60R16/02; H02G3/03; H02G3/30
Foreign References:
JP2009227070A2009-10-08
JP2003267161A2003-09-25
JP2001352636A2001-12-21
US20150036992A12015-02-05
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (10th floor, Sumitomo-seimei OBP Plaza Bldg. 4-70, Shiromi 1-chome, Chuo-ku, Osaka-sh, Osaka 01, 〒5400001, JP)
Download PDF: