Title:
WIRING MEMBER FOR MULTI-ROW TYPE SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/199472
Kind Code:
A1
Abstract:
[Problem] To provide a wiring member for a multi-row type semiconductor device, said wiring member being capable of: achieving a reduction in the thickness and size of the semiconductor device; improving adhesion between a resin and plating films of terminal parts; making the heights of internal terminal parts and the surfaces of internal terminal-side plating layers uniform; reducing warping of the resin; reducing the number of steps when producing the semiconductor device; and being mass produced in high yield with high reliability. [Solution] Semiconductor device wiring members, in which plating layers 11 which form internal terminals are formed in prescribed regions of one surface 15a of a resin layer 15, with the lower surfaces in a state of being exposed at the surface 15a, plating layers 12 which form wiring parts connected to plating layers 11 are formed, plating layers 13 which partially form external terminals are formed in areas of plating layers 12, with the upper surfaces in a state of being exposed from another surface 15b of the resin layer, and the side surfaces of laminates of the plating layers which form the internal terminals, the wiring parts, and the external terminals are substantially L-shaped, are arranged in a matrix. A metal frame part 16 is formed on the one surface of the resin layer, in an area on the outer periphery of an aggregate of the semiconductor device wiring members.
Inventors:
HISHIKI KAORU (JP)
IIDANI ICHINORI (JP)
IIDANI ICHINORI (JP)
Application Number:
PCT/JP2017/003030
Publication Date:
November 23, 2017
Filing Date:
January 27, 2017
Export Citation:
Assignee:
SH MATERIALS CO LTD (JP)
International Classes:
H01L23/12; H01L23/50
Foreign References:
| JP2002198462A | 2002-07-12 | |||
| JP2001060648A | 2001-03-06 | |||
| JP2008153622A | 2008-07-03 | |||
| JP2004241526A | 2004-08-26 | |||
| JP2001053108A | 2001-02-23 | |||
| US20100117200A1 | 2010-05-13 |
Attorney, Agent or Firm:
SHINOHARA & COMPANY INTERNATIONAL PATENT FIRM (JP)
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